WEI Qin-qin. Progress in research on carbon nanotubes interconnectionJ. Journal of Functional Materials and Devices, 2012, 18(1): 63-69.
Citation: WEI Qin-qin. Progress in research on carbon nanotubes interconnectionJ. Journal of Functional Materials and Devices, 2012, 18(1): 63-69.

Progress in research on carbon nanotubes interconnection

  • As the development of the VLSI,the amount of the interconnection in the chip scaled up while its size scaled down,and the current density in the interconnection getting bigger and bigger.In this tendency,the validity and reliability of traditional copper interconnection get worse.Carbon nanotubes,which have small aspect ratio,small resistivity and can endure larger current density,is a good candidate for the next interconnection.In this paper,we summarized the advantages of carbon nanotubes as interconnect material,the progress in the simulation of electric performance of carbon nanotube interconnection,the challenges of carbon nanotube to be used for interconnection and the countermeasures.In addition,the perspect of the studies of carbon nanotubes interconnections is given briefly.
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