Abstract:
In this paper the oxygen plasma treatment was introduced to the poly(dimethylsiloxane)(PDMS) and silicon surface modification by which they could be bonded with each other under the room temperature and the atmosphere pressure.The effect of surface modification parameters such as RF power,treating time,and oxygen flux on the bonding strength of the PDMS-Silicon wafer was investigated.By optimizing the surface modification process,the long term active surface of PDMS was obtained.The PDMS and silicon could be bonded with each other 45 minutes after oxygen plasma treatment.After analyzing the changes of the chemical composition in the PDMS sample by XPS,it is concluded that the stability of the Si-OH is the key factors affecting the bonding strength.