Abstract: Because of large bonding strength and simple process,si-glass anodic bonding is popular in seal of low price absolute pressure sensor.But a bit higher temperature and different coefficients of thermal expansion results in large residual stress in common si-glass anodic bonding.In order to reduce the influence of residual stress to device characteristics,this paper analyses anodic bonding in mechanics systematically using finite element method.In experiment,several absolute pressure sensors with diaphragm different in thickness and dimension were made using si-glass anodic bonding technology,and then wafer curvature and sensor offset were tested to research the residual stress on the diaphragm.