Abstract: In this paper, the properties of Au / Cr-CZT contacts, comparing with Au-CZT, were investigated by shearing tests, stress simulation, current-voltage test, and the multitude channel pulse-height analysis. It was shown that the adhesion strength and the thermal stability of Au/Cr compound electrode was improved compared to Au electrode contact. During the aging tests, the adhesion strength of Au/Cr compound electrode decreased by 28%, while the one with Au contact was decreased by 61.98%. Detector with Au/Cr compound electrode exhibited lower leakage current and better spectra performance. The possible reason is that the coefficient of thermal expansion of Cr matches more with CZT, rather than Au, conducing to smaller thermal stress in the contact interface. In addition the alloying process will promote the inter-diffusion at the metal-semiconductor interface, and better ohmic contact could be obtained. Consequently Au/Cr compound electrode on CdZnTe is more reasonable to gain better contact.