InGaAs/InAlAs异质结的H3PO4/H2O2系的湿法腐蚀

Wet chemical etching of InGaAs/InAlAs heterostructures using phosphoric acid/hydrogen peroxide solution

  • 摘要: 采用了H3PO4/H2O2系化学腐蚀液对GSMBE外延的InGaAs/InP和InA lAs/InP材料湿法腐蚀特性进行了研究,研究了不同浓度和配比对于腐蚀速率和形貌影响。结果表明该腐蚀液体系具有良好的均匀性,腐蚀速率随浓度呈指数关系,表面形貌基本不受浓度影响。在增加腐蚀液中双氧水含量时,腐蚀速率先增大后减小,表面形貌良好;增加磷酸浓度腐蚀速率亦有增大趋势,表面出现尖锥状小丘。并对腐蚀液配比变化对腐蚀特性影响及腐蚀机理进行了讨论分析。

     

    Abstract: Wet chemical etching using phosphoric acid/hydrogen peroxide solution on GSMBE grown InGaAs and InAlAs on(001)InP were studied.Results show uniform etch speed and crystallographic edge profile.The etch rate decrease exponentially with increasing dilution ratio,yet the surface morphology remains the same.Etch rate increases and then decreases with a smooth surface morphology as H2O2 concentration increases.And the increase of H3PO4 concentration gives rise to similar change in etch rate,with a coarser surface.The mechanisms are also discussed.

     

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