Abstract: Multichip modules （MCMs） offer an attractive approach to integrating and packaging micro-electromechanical systems （MEMS）.The primary goal of this work is to explore methods of leveragingthe advantages in microelectronic MCMtechnology for the packaging of MEMS.Afastnoise estimation forMEMS packaging is given, which has the advantage of being applicable to a wide range of packagingtypes without modification.Simulation results showthe significant improvements of MCMpackaging usedfor MEMS over previously used approaches.