倒装芯片互连时SnAg/95Pb5Sn焊料间的互扩散行为及Ni阻挡层的作用
INTERDIFFUSION BEHAVIOR OF SnAg/95Pb5Sn FLIP-CHIP JOINT AND THE INFLUENCE OF Ni AS A DIFFUSION BARRIER
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摘要: 本文研究了共晶SnAg/95PbSn扩散偶在250 ℃下的扩散行为。发现由于95Pb5Sn中的Pb向熔融共晶SnAg焊料中扩散而部分生成三元共晶Pb－Sn－Ag相，其熔点约为178℃。化学镀Ni层可以有效地阻止共晶SnAg和95Pb5Sn间的互扩散，防止Pb－Sn－Ag共晶相的生成，从而提高焊点的耐热温度。文中还研究了与共晶SnAg/Ni/95Pb5Sn结构相关的相变及力学性能。Abstract: The interdiffusion behavior of eutectic SnAg/95Pb5Sn diffusion couple was investigated. Experimental results showed that a ternary eutectic Pb-Sn-Ag phase with melting temperature near 178℃ was formed as a result of the diffusion of Pb from 95Pb5Sn to eutectic SnAg. An electroless Ni layer can effectively prevent the interdiffusion between eutectic SnAg and 95Pb5Sn. In addition, the phase transformations and mechanical properties of eutectic SnAg/Ni/95Pb5Sn were investigated.
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