栅源双场板对GaNHEMT器件性能的影响
The characteristics of gate-source double field-plates for GaN HEMT
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摘要: 本文对具有不同的栅源双场板结构的p-GaN栅HEMT器件的性能进行了比较,利用半导体器件仿真工具Synopsys TCAD对器件电学特性进行了分析。仿真结果显示:栅源复合场板结构能改善栅场板边缘的电场峰值,在源极场板边缘产生一个新的峰值,可使器件的击穿电压提高到1365V;间断栅场板与源场板复合结构,能在场板间隙位置产生新的电场峰值,更充分的利用漂移区耐压,使其击穿电压值达到1478V;栅源复合间断场板结构能缓解源场板对栅间断处电场峰值的抑制作用,器件击穿电压提高到最大值1546V。Abstract: Different gate-source field-plates of GaN HEMTs with p-GaN gate structure were compared and investigated using Synopsys? TCAD tool.The simulation results showed that a new electrical field was introduced at the end of source field-plate and the breakdown voltage of the double gate-source plates structure was improved to 1365 V.A new peak of electric filed was produced in the interval gate field-palte by interval gate and source field-plates structure,and the breakdown voltage was further improved to 1478V.The suppression of the electrical field in gate plate gap by souce field-plate was decreased in the gatesource both interval structure and the highest breakdown voltage 1546V was achieved.
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