Abstract: The experimental studying of the reliability of solder joint in dropping and impacting have been a key procedure of studying of the electronic product reliability.The paper have measured the drop performance about solder joint point based on JEDEC drop standard,and compared the effect to reliability of solder joint among the composition of solder material,fluxes,the method of substrate pad surface treatment and solder ball size and so on.Now Sn-3Ag-0.5Cu and Sn-1Ag-0.5Cu and Sn63Pb37 are three kind of solder material selected,and substrate pad with Ni/Au surface finish and organic solderability preservatives（OSP）coating in the testing.The failure model and reliability of solder joint are examined using the dye-pry and cross-section test,and the result indicate that the solder joint with a low Ag weight contented and substrate pad with OSP coating can both enhance the reliability of BGA solder joint.