Abstract: A novel embedded package structure for Microwave Multichip Module（MMCM）is studied,which is based on MEMS process and BCB thick film technology.A set of microwave chips are embedded in metalized silicon cavities,and then electrically connected through bonded gold bumps to the upper multilayer BCB/Au transmission lines.Interlayer connection is realized by electroplated gold pillars.Performance of transmission lines,electric influence to chip introduced by package and Ku-band bandpass filters that can be integrated in this package are simulated and optimized by HFSS.