Abstract: In order to achieve efficient and reliable interconnection between implantable flexible neural microelectrodes and external stimulation and record devices,an electrical interconnect method based on via-hole electroplating has been presented in this paper.In this method,a flexible interconnect film including via-hole structures was first fabricated,and then bonded on a flexible neural microelectrode after aligning its via-holes with the welding pads of the flexible neural microelectrode.After that,an electroplating process was performed to fill the via-holes with the growth of metal,which could form an electrical connection between the flexible interconnect film and the flexible microelectrode.Finally,the fabricated devices were investigated by SEM,electrical performance test,mechanical strength test,and biocompatibility test.The results show that the proposed interconnection method for the flexible microelectrodes has good reliability and stability.