Abstract: Triple-stack bonding of glass-silicon-glass（GSG） structure is an important process,which is primarily used in professional fields including optical MEMS、micro-inertial devices、micro-fluidic chip、RF MEMS and wafer-level packaging（WLP） with low-cost.The dissertation focuses on the exact grinding and polishing processing、anodic bonding and combining with novel glass via-hole etching technology.The study of triple-stack anodic bonding based on the controllable thickness of silicon between glasses has been developed and finally GSG micro-fluidic device have been made successfully.The thickness of the whole chip and in-between silicon are 1360μm、60μm respectively.The diameter and space of via-hole（the space between the center of the hole）are 100μm、200μm respectively,and the parietal of the via-hole is smooth and non-etching side.The bonding rate of the triple-structure is 90%.