PECVD法制备纳米晶粒多晶硅薄膜

Preparation of nano-grain poly-silicon thin films by PECVD

  • 摘要: 采用射频等离子体增强化学气相沉积系统(RF-PECVD)以高纯SiH4为气源在P型<100>晶向单晶硅片上、衬底温度600℃、射频(13.56MHz)电源功率50W时沉积非晶硅薄膜,利用高温真空退火制作纳米晶粒多晶硅薄膜。采用X射线衍射仪(XRD)、Raman光谱、AFM测量和分析薄膜微结构及表面形貌,实验结果表明,退火温度为800℃时非晶硅薄膜晶化,形成择优取向为<111>晶向的多晶硅薄膜;退火温度增加,Raman谱TO模和TA模强度逐渐减弱;AFM给出800℃退火后薄膜晶粒明显细化,形成由20~40nm大小晶粒组成的多晶硅薄膜,薄膜晶粒起伏程度明显减弱。

     

    Abstract: Adopted radio frequency plasma enhanced chemical vapor deposition system(RF-PECVD),and high pure SiH4 as air-source separately,so that deposited polycrystalline silicon thin films on P-type <100> single silicon,when temperature of underlay is at 600℃ and electrical power of emitting-frequency 13.56MHz is 50W,adopted high temperature and vacuum-annealing to fabricate amorphous silicon thin films of nanometer crystalline grains.Took advanced of X-ray Diffraction Apparatus(XRD)、Raman Spectrum 、and AFM to measure and analyze thin-film micro-structure and surface appearance.The result of the experiment shows that the polycrystalline silicon thin films crystallized,when the annealing temperature was at 800℃,and then formed <111>polycrystalline silicon thin films of selective better direction;with increasing temperature,intensity of Raman Spectrum TO and TA films weakens gradually;AFM gives that thin-film crystalline grains become significantly slender after 800℃ annealing,and formed polycrystalline films of grain sizes from 20 to 40nm,ups and downs degree of thin-film crystalline grains weakened significantly.

     

/

返回文章
返回