Abstract: In this paper, the application of gold-indium isothermal solidification technique in die attachment for ceramic packages is investigated. With a simple design of the multilayer system and mechanical vibration, silicon chip can be bonded onto the allumina substrate within 15 seconds between 250 ℃ and 300 ℃ in nitrogen atmosphere. Most of the samples can satisfy the shear strength test specified by MIL STD 883D. The reliability of the bonds is e valuated with thermal cycle test, and 1750 cycles test between -55 ℃ and+125 ℃, only slight degradation in die shear strength after the test is observed. The microstructures of the bonds are characterized with metallographical investigation.