超厚SU-8负胶高深宽比结构及工艺研究

Process study of high-aspect-ratio ultrathick SU-8 microstructure

  • 摘要: 采用新型SU-8光刻胶在UV-LIGA技术基础上制备了各种高深宽比MEMS微结构,研究了热处理和曝光两个重要因素对高深宽比微结构的影响,解决了微结构的开裂和倒塌等问题;优化了SU-8胶工艺,从而获得了最大深宽比为27:1的微结构。

     

    Abstract: Various high aspect ratio microstructures were prepared on the basis of UV-LIGA technique by using a new type of SU-8 photoresist. The influences of heat treatment and exposure on high aspect ratio microstructures are mainly discussed. The cracking and collapse of microstructures are favorably solved. Based on a series of contrast experiments, the SU-8 process is optimized and the highest aspect ratio of microstructures with 27:1 is successfully obtained.

     

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