LPCVD生长结构层多晶硅和掺P多晶硅的工艺
Process of LPCVD polysilicon and phosphorus doped polysilicon
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摘要: 对LPCVD生长结构层多晶硅和掺P多晶硅的原理进行了阐述,分析了薄膜质量与各项工艺参数的关系。实验时,对各项工艺参数进行调节,在保证薄膜质量和片内一致性的同时取得最大的生长速率。生长出来的多晶硅结构层厚度达到2μm;掺P多晶硅的厚度达到1000。Abstract: This paper discussed the process of LPCVD polysilicon and phosphorus doped polysilicon in detail,and analysed the relationship of the film quality and the process parameter.Adjusted the process parameters during the experiments,kept the film quality and consistency meet our requirement to acquire the fastest deposit rate.The thickness of LPCVD polysilicon film has achieved 2μm;and the thickness of LPCVD phosphorus doped polysilicon film has achieved 1000?.
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