Abstract: Finite element simulations are applied in frequency-domain analysis and time-domain analysis for a packaged accelerometer used in high G environments. In order to understand the effect of adhesive material between the sensor chip and the package bulk on output signal of accelerometer, a simplified packaged construction is adopted in the analysis. Frequency-domain analysis shows that the Young’s moduli of adhesive materials have an important influence on the mode shape of packaged accelerometer and the small Young’s modulus will bring in a strong distortion of outputs of accelerometer. The results of time-domain static analysis show that the maximal equivalent stress, the maximal normal stress, and the maximal and minimal normal stress in vertical direction of loading are not affected by the Young’s modulus of adhesive in these simulations. In time domain transient analysis, the results show that the wave shapes of accelerometer output signals become better after digital filtering as the Young’s modulus increase. The results simulated also show that the frequency and average value of outputs are not affected by the Young’s modulus of adhesives, and the outputs are dependent linearly on the inputs very well as the inputs of the acceleration amplitudes change.