扩散阻挡层对Cu-Zr合金膜表面形貌与结构的影响

Effect of diffusion barrier on surface morphology and structure of Cu-Zr alloy films

  • 摘要: 用磁控溅射和离子束溅射共沉积的方法,分别以TiN、TaN、ZrN为扩散阻挡层,在单晶硅片上制备了Cu-Zr合金膜,膜在400℃氮气中退火1h。研究表明,不同扩散阻挡层上Cu-Zr膜的形貌不同,沉积态膜的组成颗粒以ZrN为扩散阻挡层的最小,退火后膜的颗粒长大,且Zr向膜表面和界面处扩散。沉积态的膜具有强的(111)取向,峰形宽化明显,退火后又出现(200)、(220)、(311)衍射峰,扩散阻挡层不同时Cu-Zr合金膜的(200)与(111)的强度比值不同。

     

    Abstract: Cu-Zr alloy films were deposited on TiN,TaN and ZrN diffusion barriers with co-sputtering technology that combined magnetron sputtering(MS)and ion beam sputtering(IBS).The films were annealed at 400℃ for 1h in N2 .It is found that after annealing,Zr in the film diffuses to the surface and the interface,and the surface morphology and particle size vary with different diffusion barriers.The films on ZrN diffusion barrier has the smallest particle size.The as-deposited Cu-Zr alloy films have a strong(111)texture and broaden peaks.After annealing,the Cu-Zr alloy films become less oriented.There appear(200),(220)and(311)peaks,besides(111)peak and the integrated intensity ratio of(200)/(111)is different for different film/barrier system.

     

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