Abstract: A new die bonding technique based on Au/In isothermal solidification is studied. The process and material parameters such as mechanical vibration, load, thickness of the Au and In layers, surface roughness are evaluated. Bonding with big die size (3×3 mm²) is achieved in between 250℃-300℃ with high speed and relative low cost. The bonds could withstand 3200 cycles between -55℃ to 125℃ without obvious degradation.