Abstract: The residual stress induced by packaging has been an important problem in the electronic packaging and assembly.Silicon piezoresistive sensor is applied here to in-situ record the curing stress evolution for different adhesives and the distributions of the residual stress.Results indicate that lower residual stress will be obtained when an organic adhesive with lower thermal expansion co-efficient is employed to bond the chip.This method can be used as a reference to select an ideal adhesive for COB（Chip on Board）packages.