多孔硅外延层转移制备SOI材料的研究

SOI material fabricated by using epitaxial layer transfer of porous silicon

  • 摘要: 用多孔硅外延层转移的方法成功地制备出了SOI材料,卢瑟福背散射/沟道谱(RBS/C)和扩展电阻(SPR)的结果表明获得的SOI材料上层硅具有很好的单晶质量,电阻率分布均匀,上层硅与氧化硅埋层界面陡直。对制备多孔硅的衬底材料也作了研究,结果表明P型重掺杂的硅衬底在暗场下阳极氧化后仍保持很好的单晶性能,用超高真空电子束蒸发方法能外延出质量很好的单晶硅,并且,在一定浓度的HF/H2O2溶液中具有较高的腐蚀选择率,保证了上层硅厚度的均匀性。

     

    Abstract: SOI material was successfully fabr icated by using epitaxial layer transfer of porous silicon.The result of Rutherford backscatte ring spectroscopy and channeling (RBS/C) shows that the crystalline quality of top Si layer is good.Spreading resistance probe technology (SRP) indicates that the resistivity of top silicon layer is uniform and the interface between the top silicon layer and SiO2 buried layer is very sharp.The effect of silicon type before anodizing on the subsequent steps was also studied.Experimental results show that the porous silicon made from P type Si main tains good crystalline quality.And epitaxial silicon layer with good crystalline quality grew on it by using ultra-vacuum electronic beam evaporation.Furthermore,com paring body silicon,the corrosion rate in HF/H2O2 solution with a certain concentration is very high,which ensures the thickness of top Si layer.

     

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