ECR-CVD制备氟化非晶碳低k介质薄膜

Low-dielectric-constant fluorinated amorphous carbon films prepared by ECR-CVD

  • 摘要: 采用电子回旋共振等离子体化学气相沉积(ECR-CVD)方法,以C4F8和CH4为源气体在不同气体流量比R(R=CH4/CH4+C4F8)条件下成功地沉积了氟化非晶碳(a-C:F)低介电常数(低k)材料。采用X光电子能谱和椭圆光谱方法分析了a-C:F薄膜的化学组分和光学性质。沉积的a-C:F薄膜介电常数约为2.1~2.4,热稳定性优于350℃。随着气体流量比的增大,沉积a-C:F薄膜中的碳含量增大,CF、CF2、CF3含量减少,C-C交链成分增加,从而使得π-π*吸收增强,并引起薄膜光学带隙下降。氮气气氛下350℃温度退火后应力释放引起a-C:F薄膜厚度变化,变化量小于4%。450℃温度退火后,由于热分解作用薄膜厚度变化量在30%左右。

     

    Abstract: Low-dielectric-constant(low-k) fluorinated amorphous carbon(a-C:F) films were prepared by electron cyclotron resonance chemical vapor deposition(ECR-CVD) method with varying the gas flow ratio R(RCH4/+C4F8).Chemical compositions and optical properties were investigated by X-ray photoelectron spectroscopy(XPS) and spectral ellipsometry(SE),respectively.a-C:F films with dielectric constant of 2.1~2.4 and thermal stability higher than 350℃ were obtained.The CF,CF2 and CF3 bonds decrease and the C-C bonds increase with increasing gas flow ratio,which leads to enhancement of π-π* absorption and reduction of optical gap.Film thickness change is less than 4% due to stress release between the a-C:F films and the silicon substrates after 350℃ annealing.The film thickness change is around 30% mainly due to thermal decomposition of volatile fluorocarbon species after 450℃ heat treatment.

     

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