PECVD法生长氮化硅薄膜及其微结构梁特性的研究
Study of Thin films of Silicon Nitride Deposited by PECVD and Beam Properties
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摘要: 采用化学气相沉积法(PECVD)在石英基片上制备氮化硅薄膜,应用MEMS工艺将氮化硅薄膜制作成双端固定的微结构梁,纳米压痕仪测量氮化硅薄膜的杨氏模量表明其值在136~172 Gpa之间,用曲率半径法测试薄膜的残余应力,并对微结构梁的弹性系数进行计算,结果表明弹性系数值在11.4~57 N/m.之间,根据实验所得弹性系数对微结构梁的驱动电压进行计算,其驱动电压在32.8~73V之间,微结构梁的实际驱动电压测得为34~60V。Abstract: The thin films of silicon nitride were prepared on the quartz substrate by PECVD.The fixed-fixed nitride beams were fabricated using MEMS process.The nanoindentation measurement showed that Yang’s modules of nitride thin film was 136~172Gpa.The residual stress was obtained by wafer-curvature measurement method to evaluate the spring constant of nitride beam.The spring constant of the beam was ranging from 11.4 to 57 N/m.The actuated voltage was derived from 32.8 to 73V according to the spring constant.The actuated voltage of the beam was measured from 34 to 60V.
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