LEC技术生长3inch掺Si GaAs单晶的研究
Research on 3 inch Si-doped GaAs crystal by LEC technology
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摘要: 采用高压LEC工艺生长 3inch掺SiGaAs单晶, 掺杂浓度大于 1×1018/cm3,晶体位错密度小于 1×104/cm2 。实验发现, 采用PBN坩埚和使用水含量较高的氧化硼做覆盖剂, 固液交界面处均会产生浮渣, 造成无法引晶。而实际掺杂量应为理论计算值的 4倍以上。Abstract: 3 inch in diameter Si-doped GaAs single crystals have been grown by high pressure LEC technology. Si concentration is greater than 1×1018/cm 3 and EPD is less than 1×104/cm 2. It has been found that there was slag resulting in non-crystallizability on solid-liquid interface when PBN crucible or B2O3 with much water was used and the necessary dopant weight was 4 times more than theoretical doping amount. The results were explained.
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