Abstract: A micro vacuum sensor based on field emission of silicon tips array is brought forward firstly by integration of the MEMS technology.The relation between emission current and pressure has been introduced by theoretical analysis.200 42 tips array with 3.2μm height and below 70nm diameter has been fabricated on the silicon substrate using dry etching process.Keeping 1μm distance between the silicon tips and anode electrode,the emission current can be observed at 10V anode voltage.From test results,the micro vacuum sensor has a lower error with the range of 10-15V,which less than 10 percent can be achieved.Because this micro vacuum sensor is characterized of high sensitivity,easiness for integration and no sealing chamber in the sensor,it has very promising applications and potential market.