Abstract: A series of glass/ceramic composites were prepared using electronic ceramics process from borosilicate glass with spinel. Results show that the thermal expansion coefficient, dielectric constant and hardness of the composites increase with the content of spinel increasing. However, aluminum borate formed during the sintering process has a definite effect on the properties. The obtained composites exhibit low dielectric constant（5.5-6.5）, low thermal expansion coefficient(5.3×10^-6-5.5×10^-6℃^-1)and low sintering temperature（≤1000℃）. It is for application as microelectronic packaging substrate.