Abstract: 1st level package structure for MMICs was studied,using Rogers 4003 organic high frequency substrate material and PCB manufacturing process.The package is compatible with SMT process and has advantages of excellent heat transmitting capability and low cost.The package structure can be used for X＆Ku Band Driver Amplifier chips.Package design and optimization was implemented using 3D electromagnetic field simulation software,package sample was manufactured and the performance of the packaged X＆Ku Band Driver Amplifier chip was tested.using HP 8722D High Frequency Network Analyzer.Test result indicates that packaged chip has a return loss of less than-10dB and a gain of higher than 20dB along 6~18GHz frequency range,which well matches the bare die performance.