Abstract: The electromigration test analysis and simulation of Al via in ULSI interconnect are investigated under the accelerated condition of different temperatures and constant current,the test sample fails when via circuit opens,and it gives the electromigration reliability lifetime of Al via for experiment data under the accelerated condition.Based on the simulation software platform ANSYS,simulation programs for Al via electromigration of thermoelectricity coupling effect are developed,results show that the top temperature is higher 9.576K than environment,and accords the calculated result by via self-heat theory model.The calculated electromigration reliability lifetime based on the modified temperature under normal work condition approaches to factual value much more.This work has a significant result on the research and lifetime evaluation for Al via electromigration.