Ni-Cu-P合金化学镀层制备及组织结构的研究

Deposition and microstructure of electroless Ni-Cu-P deposits

  • 摘要: 研究了Ni-Cu-P化学镀液主要成分、pH值及时间等工艺参数对化学沉积Ni-Cu-P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数,得到了Cu含量从0到56.18 wt%的Ni-Cu-P合金镀层。利用X射线能谱术(EDS)和X射线衍射术(XRD)研究了镀液中硫酸铜浓度对Ni-Cu-P合金镀层成分及组织结构的影响。在硫酸铜浓度低于3 g/l时,Ni-Cu-P合金镀层中P含量高于7.05 wt%,合金镀层是非晶态结构。

     

    Abstract: Effects of the deposition parameters such as bath composition, pH and time on the element contents and deposition rate of the electroless Ni-Cu-P deposits were studied. The electroless Ni-Cu-P deposits with various copper contents from 0 to 56.18 wt% were prepared by choosing the proper deposition parameters. The effect of copper sulfate concentration in the bath on the composition and microstructure of the electroless Ni-Cu-P deposits was studied by X-ray energy dispersive spectroscopy (EDS) and X-ray diffraction(XRD). Ni-Cu-P deposits with phosphorus content more than7.05 wt% are amorphous, in the situation that the copper sulfate concentration in the bath is lower than 3 g/l.

     

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