Abstract: Hermetic package is necessary for MEMS devices because they are very sensitive to the environment, such as stress, dust, humidity, gas flow, temperature and so on.A low-temperature wafer-level encapsulation technique was presented to hermetically sealed MEMS devices. A cap wafer is bonded to the device wafer using a pre-solidified frit glass as a bonding medium such that the devices are hermetically sealed inside the cavities. Shear and leakage test were performed to investigate the bonding strength of the sealing structure and the hermeticity of the encapsulation.The results prove that the leakage fulfill the corresponding MIL-STD.