氧化增强注氧隔离工艺制备绝缘体上的硅锗

SiGe-on-insulator fabricated by oxidation enhanced SIMOX

  • 摘要: 提出一种氧化增强注氧隔离工艺,在退火前氧化得到SiO2层,再进行高温退火得到绝缘体上的硅锗材料。经X射线摇摆曲线和拉曼测试发现所制备的绝缘体上的SiGe材料锗含量没有发生损失,且应变弛豫完全。透射电镜和二次离子质谱分析结果显示样品多层结构清晰,埋氧层质量完好、平整度高、无不连续、无硅岛。研究表明,氧化增加工艺的引入是绝缘体上的硅锗材料锗质量提高的关键。

     

    Abstract: A unique SIMOX method was introduced to fabricate SGOI and resolve the problem of Ge loss.During the process,a SiO2 layer was formed firstly pre-annealing to block the Ge out-diffusion.It results in full relaxed SGOI with Ge fraction amounts to 17at% as the X-ray rocking curve and Raman Spectra studies shown.The influences on heterostructure and compositional depth profiles by the surface oxide layer were explored by cross-sectional transmission electron microscopy and secondary ion mass Spectrometry studies.The final sample exhibits planar and continuous buried oxide layer,sharp interfaces and defects free SGOI.The results indicate that the additional step of thermal oxidation pre-annealing is vital for improving the crystalline quality of the SGOI.

     

/

返回文章
返回