退火对Al/CdZnTe肖特基接触特性的影响

Annealing impact on Al/CdZnTe schottky contact

  • 摘要: 在CdZnTe表面采用真空蒸镀制备了Au和Al电极,研究了在N2氛围退火对Al/CdZnTe接触特性的影响。退火温度在100℃到300℃之间变化,退火时间为5 min。采用Agilent4155c半导体测试仪测试了样品在不同温度退火后的I-V特性。采用Agilent 4294A高精度阻抗分析仪测试了样品在不同温度退火后的C-V特性。I-VC-V曲线表明,低温退火会使接触势垒高度增加,理想因子趋近于1,电容值下降为退火前的一半左右。当退火温度高于250℃时,接触势垒高度下降,理想因子偏离1,电容值下降近一个数量级。

     

    Abstract: Au and Al electrodes were deposited by thermal evaporation onto CdZnTe surfaces,the effects of annealing conditions on the properties of Al/CdZnTe contact were studied.The sample was annealed at varies temperature in the region from 100℃to 300℃for 5 min under·N2 ambience.Room temperature I-V and C-V characteristics of the sample annealed at different temperature were measured by Agilent 4155c Semiconductor Parameter Analyzer and Agilent 4294A impedance analyzer respectively.I-V and C-V curves shown that annealed at low temperature,the Schottky barrier height of Al/CdZnTe increases, ideal factor is close to 1,and the capacitance of the Schottky reduces for almost 50%.However,annealing at the temperature higher than 250℃,the Schottky barrier height decreases,meanwhile the ideal factor deviates from 1,and the capacitance of the Schottky is decreased for an order.

     

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