HfOx薄膜双极电阻转变特性及其机理的研究

Resistance Switching of HfOx Film for RRAM Applications

  • 摘要: 本文采用射频磁控溅射法在ITO/Glass衬底上制备了Cu/HfOx/Ti MIM结构,对其电学性能和化学成分进行了分析。结果表明,Cu/HfOx/Ti结构在不发生软击穿(forming)的情况下具有明显的双极电阻转变特性,高低阻比大于10,并且具有良好的重复性与保持性。HfOx薄膜中含有大量的氧空位,电阻转变过程可能与氧空位形成的导电细丝有关。

     

    Abstract: The HfOx thin film with resistive switching behaviors was grown on ITO/Glass substrate by Radio frequency-magnetron sputtering method.The electrical properties and chemical composition of the film were analyzed.The results of Electrical tests indicate that Cu/HfOx/Ti show a clearly bi-polar resistive switching without a forming process is revealed.The memory also performs great reliability,and the high-resistance to low-resistance ratio is greater than 10.XPS analysis shows that film contains large amounts of oxygen vacancies.Cu is not throughout the whole HfOx thin film.The mechanism of resistive switching may be associated with oxygen vacancies.

     

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