工业级和宇航级FPGA器件抗力学性能分析
Mechanical Characteristic Analysis on Package of Industrial-grade and Aerospace-grade FPGA
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摘要: 分析了工业级和宇航级FPGA在封装结构上的差别,采用Ansysworkbench有限元软件分析了这两种封装器件在随机振动和冲击载荷下的等效应力。结果表明,工业级FPGA在随机振动和冲击载荷下,等效应力均远小于Sn063Pb37焊球材料抗剪强度,具有足够的安全余量。宇航级FPGA在垂直设备安装面方向的随机振动和冲击载荷下,最大等效应力均已超过90Pb10Sn焊柱材料抗剪强度,对其采取加固措施是必要的。Abstract: The difference of package structure between industrial-grade and aerospace-grade FPGA is discussed. Using the finite element software Ansysworkbench,the equivalent stress of the package under random vibration and shock Load are investigated. The results show that the equivalent stress of industrial-grade FPGA is far less than shear strength of Sn63Pb37 material under random vibration and shock Load,it’s security enough. The maximum equivalent stress of aerospace-grade FPGA has exceed shear strength of 90Pb10 Sn material,the staking adhesive on corner are necessary.
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