Abstract: Anodic bonding quality was quantitatively evaluated in terms of tensile strength.The strengthof anodically bonded silicon-glass samples was investigated for 81 different bonding conditions, threeconditions for each of the four parameters, including bonding temperature, cooling rate, annealing tem-perature and annealing time.Taguchi method was used to reduce the number of experiments required forthe bonding quality evaluation, thus resulting in 9 experiment cases out of 81 possible cases.Fracturestrength was measured with an in-house tensile testing machine.The influence of bonding process con-ditions on the tensile strength was quantified and discussed.It is found that the cooling rate after bondingis the most dominant factor influencing the anodic bonding strength and lowcooling rate after bonding willresult in high strength.Some ruptured interfaces after tensile testing are analyzed by SEMand the failuremechanisms are discussed.