无线传感网3D-MCM封装结构的设计与实现
Development of 3D multichip module for wireless sensor networks
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摘要: 设计和实现了一种新型的三维多芯片组件(3D-MCM)。采用融合了FCOB(flip-chip on board)、COB(chip on board)、BGA(ball grid array)等技术的三维封装(3D packaging)形式,通过倒装焊和引线键合等互连技术在高密度多层有机基板上实现了塑封BGA器件和裸芯片的混载集成。对器件结构的散热特性进行了数值模拟,并对热可靠性进行了评估。实现了电功能和热机械可靠性,达到设计要求并付诸应用。Abstract: A new type of 3D multichip module（3D-MCM） is developed.In this 3D-MCM,FCOB（flip-chip on board）、COB（chip on board）、BGA（ball grid array） technologies are combined together with 3D packaging,wire bonding and Flip-chip interconnection technologies are combined together,and the PBGA device and bare die are hybrid-integrated on multi-layer FR-4 substrate.The thermal behavior and reliability of 3D-MCM are simulated and evaluated respectively.
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