银铝锗对硅功率器件中硅和钼连接界面结构的影响

THE EFFECT OF Ag-Al-Ge SOLDER ON THE INTERFACE STRUCTURE OF Si-Mo CONTACT OF POWER SILICON DEVICES

  • 摘要: 借助热机械分析,X-射线衍射和SEM研究了AgAlGe合金的线膨胀系数,结构和用Ag24Al43Ge33焊接的硅和钼连接界面的结构,探讨了银对它们的影响。结果表明:AgAlGe的线膨胀系数接近银的膨胀系数。在硅和钼的连接界面存在Ag2Al,Al和Ge,Ag2Al的存在提高了连接界面的再熔化温度,减少了硅片的腐蚀深度。

     

    Abstract: The coefficient of linear expansion, the structure of AgAlGe and theinterface structure of molybdenum to silicon bonded by alloy Ag24Al43Ge33 were studied by means of thermomechanicalanalysis, x-ray diffraction and SEM. The effect of silver on thestructural characteristics were also investigated. The results showedthat the coefficient of linear expansion of AgAlGe is close to that ofsilver. The existence of Ag2Al, Al, Ge on the interface of Si-Mocontact raised the melting temperature of the interface andsuppressed the corrosion of silicon.

     

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