Abstract:
This paper reports the measurement of a new Si/Al
2O
3/BCB multilayer thin-film substrate based on the high dielectric constant of Al
2O
3 thin film and the thick-film of BCB. CPW structure transmission lines were fabricated on three different substrates (Si, Si/BCB and Si/Al
2O
3/BCB) by the technique compatible with the CMOS semiconductor fabrication process. The simulated and measured results showed that Si/Al
2O
3/BCB multilayer substrate could effectively reduce the transmission line loss on normal silicon based substrate (loss for CPW is 1.18dB/mm at 20GHz), which realized the low transmission loss of RF and Microwave circuits, and demonstrated wide application potentials.