微流控芯片模具非平面微电铸技术

Non-planar electroforming of microfluidic mold insert

  • 摘要: 研究了微流控芯片中大线距/线宽比条件下的UV-LIGA制作工艺。针对微电铸的要求,优化了大面积SU8曝光的工艺;通过计算机模拟分析和实验验证手段,提出了一种非平面微电铸方法,有效的解决了大线距/线宽比条件下的UV-LIGA工艺,为微流控器件的批量化制作成奠定了坚实的基础。

     

    Abstract: The fabrication of microfluidic chips by UV-LIGA process with the large ratio of line space to line width was studied.The process of large area exposure of SU8 was optimized for the micro-electroforming;a novel non-planar micro-electroforming method was developed for the large ratio of line space to line width.The results indicate that this new micro-electroforming technique will enable the mass fabrication of microfluidic chips by UV-LIGA process.

     

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