Abstract: Traditional preparation in LiNbO3 SAW(LNO), LiTiO3(LTO) on the body, such as piezoelectric materials. The main problem of these bulk monocrystallous materials is their high cost and not compatible with CMOS process. In recent years, more and more researchers began to devote themselves to developing thin film SAW devices. In this paper, based on the preparation of LiNbO3 and LiTiO3 thin film materials bonding process makes a comprehensive review research progress and industrialization progress, provide certain reference for subsequent research.