Abstract: Zn_0.1Fe_0.3Co_1.5Mn_1.1O₄NTC thermal ceramics were prepared by solid state reaction method. The effects of molding process and packaging process on the electrical properties of Zn_0.1Fe_0.3Co_1.5Mn_1.1O₄ NTC thermal ceramics systematically studied using SEM and electrical properties characterization. Results show that the microstructure and grain size of the thermal ceramics are not affected by molding process. The isostatic process is beneficial to improve the compactness and electrical properties. The resin packaging process does not affect the electrical properties, but the thermal shock of 705 °C/2 min under the glass packaging process has a great influence on the electrical properties, and the resistivity are increased by 38.59 % and 15.63 %. The glass tube can reduce the thermal shock of the high temperature on the thermal ceramic material.