用于LED驱动芯片的500V级SOI高压器件的研究
The Study of 500V-class High Voltage Device on Thin SOI for LED Driver ICs
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摘要: 本文针对现代LED驱动芯片对高压元器件的需要,结合SOI衬底技术在功率集成电路上的优势,分析了SOI高压器件的耐压原理,提出500V级SOI高压器件设计方案。在SOI衬底上设计了具有40μm线性渐变掺杂漂移区的LDMOS结构,对器件性能进行了仿真,并开发了与CMOS工艺兼容的制备流程。成功进行实验,测试结果显示,器件击穿电压可达550V,比导通电阻为5.8Ω·mm2。Abstract: According to the applications of modern LED driver ICs and the advantages of SOI technology for power ICs,we analyze the breakdown theory of the SOI device and propose the design project for 500V class high votage devices.An optimized SOI LDMOS device with 40μm linearly graded doping profile drift region is designed and simulated by TCAD tool,then CMOS compatible processes are developed and implemented successfully.Off-state breakdown voltage of the device can reach 550V,and the specific on-resistance is 5.8Ω·mm2.
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