三五族器件技术与产业趋势报告

Ⅲ-Ⅴ device technology and industry trend report

  • 摘要: 以GaAs、InP和GaN为代表的三五族化合物材料具有比硅材料更大的禁带宽度和电子迁移率等特性, 满足现代电子技术对高温、高频、大功率等条件的新要求, 在通信技术、汽车电子领域成为发展前沿。随着5G、新能源汽车、太阳能、节能(快充)技术的迅速发展, 三五族化合物市场将持续增长。GaAs、InP和GaN器件技术与产业在射频、光电和功率器件应用方面发展趋势乐观。

     

    Abstract: Ⅲ-Ⅴ compound materials such as GaAs, InP and GaN have wider band gap and electron mobility than silicon, which can meet the new requirements of modern electronic technology for high temperature, high frequency, and high power. Ⅲ-Ⅴ compound materials are becoming the development frontier in the fields of communication technology and automobile electronics. With the rapid development of 5 G, new energy vehicles, solar energy, and energy-saving(fast charging) technologies, the market for Ⅲ-Ⅴ compound materials will continuously grow. The development trend of GaAs, InP and GaN device technology and industry in the application of radio frequency, optoelectronics and power devices are optimistic.

     

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