深亚微米SOAN MOSFETs的高温应用分析与结构优化

High temperature application analysis and structural optimization of DSM SOAN MOSFETs

  • 摘要: 在300~600K温度范围内分析并模拟了栅长为100nm的SOI(Silicon On Insulator)和SOAN(Silicon On Aluminum Nitride)MOSFETs的输出特性和有源区温度分布,得出了SOAN器件更适合高温应用的结论;针对高温应用环境,对SOAN器件结构参数及工艺参数进行优化,得出了各个参数的优化值,并使用优化后参数仿真CMOS反相器的瞬态特性,结果显示在环境温度为300K和500K时,SOAN CMOS门极延迟分别为19ps、25.5ps;而SOI CMOS的门极延迟在相同的温度下分别为28.5ps、35.5ps。

     

    Abstract: The Id-Vd characteristics and temperature distributions of active area of the SOI and SOAN devices are simulated and analyzed over a range of 300K to 600K,and a conclusion that SOAN device is much more suitable for high temperature application is drawn;some optimization of structural and processing parameters of SOAN device are carried out in allusion to high temperature application circumstance,and their optimized values are gained.A CMOS inverter consisted of optimized NMOS and PMOS is put up,and its transient characteristic is simulated.The simulated figure demonstrates that the gate propagation delay of SOAN CMOS is 19ps and 25.5ps,when the ambient temperature is 300K and 500K;the delay of its SOI counterpart is 28.5ps and 35.5ps at the two temperature points respectively.

     

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