Abstract: The strain energy release rates G were calculated by employing the J-integral in a small rectangular path near the crack tip in the related finite element simulations.And under thermal cycling loading,the crack propagation rates of two types of test chip（type B and D）were determined by using C-SAM inspection.The Paris half-empirical equation,which can be used as a design base of flip chip package reliability,is determined from the energy release rates simulated and the crack propagation rates measured.