Abstract: This paper reported on the glass frit wafer bonding,which is a universally usable technology for hermetically sealing MEMS devices.The package process demonstrated from screen printing,glass frit firing to wafer bonding.To improve glass frit printing uniformity,detail process characterization of glass frit printing by using precision screen printing machine were carried on and discussed in this work.Shear and leakage test results fulfilled the corresponding MIL-STD.It allows hermetic sealing and a high process yield.