Abstract: A strategy for MEMS wafer level packaging utilizing Epo-Tek 301 as a adhesive layer in bonding is developed.The plastic packaging cap is formed by hot-embossing and is trimmed into 4-inch scale wafer by laser.Then plastic wafer and silicon wafer can be bonded together with a layer of optimized 12μm thick adhesive without any pressure or heat.Little stress is introduced during this process and bonding strength could meet most applications.Wafer dicing is finished in two steps.PMMA is diced with laser,and silicon is diced mechanically.Microfluidic chips packaged in this way have gotten through test.For its simple process and low cost,this strategy can be utilized both for MEMS packaging and temporary dicing protection.