SnAgCu(SnPb)/Ni和SnAgCu(SnPb)/Cu界面金属间化合物在热冲击过程中的生长规律

Growth behavior of IMC at SnAgCu（SnPb）/Ni and SnAgCu（SnPb）/Cu interface during thermal shock

摘要: 通过对SnAgCu(SnPb)/Ni和SnAgCu(SnPb)/Cu界面热冲击过程中金属间化合物(Interme-tallic compound,IMC)生长规律的研究,以期更好的了解SnAgCu无铅焊料与Ni或Cu金属化层的相互匹配。结果表明固溶在焊料中的Cu或者Ni影响热冲击过程中界面IMC的演化。采用N iAu镀层时,IMC的生长速率比HASL(HotAir Solder Level)镀层慢,并且界面没有Kirkendall孔洞生成,所以有更好的长期可靠性。采用SnAgCu焊料时,界面Kirkendall孔洞较SnPb焊料少,界面IMC的生长速率较SnPb焊料慢。

Abstract: IMC growth behavior at SnAgCu（SnPb）/Ni and SnAgCu（SnPb）/Cu interface was studied in order to obtain more information about the compatibility of SnAgCu with Cu and Ni during metallization. The results show that Cu and Sn dissolved in the solder affect the evolution of IMC at interface during thermal shock. NiAu surface coating has better long term reliability than HASL surface coating because its IMC growth rate is slower and no Kirkendall voids are found at interface. When the SnAg Cu solder is used, Kirkendall voids are less than that of SnPb solder and IMC growth rate is slower than that of SnPb solder.