Abstract: This paper reports fabrication of via-hole on Pyrex7740 glass wafer by wet-etching technique. Firstly silicon and glass wafers were anodically bonded together and glass wafer was thinned to about 100 m.Then three kinds of materials（such as PECVD SiC and Poly -Si and W/Au） were prepared and patterned as hard-mask respectively.Lastly via-holes were realized by 40%HF wet-etching on glass wafer.This process is very simple,low price and IC compatible.The vertical and lateral etching processes were studied and profile of the via-hole was observed.The masking impact of three kinds of hard-masks was compared.This work can be useful for the fabrication of some MEMS device, especially wafer-level vacuum package.