射频溅射两步法制备立方氮化硼(c-BN)薄膜

Two-step deposition of cubic boron nitride thin film by RF sputtering technique

  • 摘要: 用常规射频(RF)溅射系统,采用两步法在Si(111)衬底上制备出较高粘附性的立方氮化硼(c-BN)薄膜。沉积过程分为成核(第一步)和生长(第二步)两步,当由第一步变为第二步时,工作气体由Ar气变为Ar和\mathrmN_2的混合气体,衬底温度和偏压也降为较低的值。对不同生长阶段的薄膜进行了SEM、FTIR分析,对最后沉积的薄膜进行了XPS分析。结果表明:采用两步法在Si(111)衬底上沉积的c-BN薄膜内应力较之常规方法减小约11.3 GPa,薄膜的B、N原子之比为1.01,c-BN的体积分数为88%,薄膜置于自然环境中6个月尚未有剥离现象。文中还讨论了c-BN薄膜的综合生长机制。

     

    Abstract: The two-step deposition,in which the deposition procedure was divided into two sections,wasused to synthesize c-BN adherent thin film by using the conventional RF system.Both the substrate temperature and the bias voltage as a parameter of particular interest were reduced when switching working gas from Ar in the firststep to mixed Ar+N2 in the second one.The analyses of SEM and FTIR for the growing films indifferentsteps and XPS analysis for the grown film were conducted.The stress in the film deposited on Si (111) substrate prepared by the two-step deposition 11.3 GPa,which is less than that deposited on Si (100) by using conventional method,according to the analysis of FTIR for the films.The ratio of B/N (1.01) indicates almost full stoichiometry and the volume ratio of c-BN is equal to 88%.The film does not peel off after six months.A compre-hensive mechanism is discussed for the film's growth.

     

/

返回文章
返回